-
1
-
-
33750814162
-
Mechanism of charging damage during plasma-enhanced silicon nitride/oxide thin-film deposition
-
Cheung K.P. Mechanism of charging damage during plasma-enhanced silicon nitride/oxide thin-film deposition. IEEE Transactions on Device and Materials Reliability 6 3 (2006) 448-454
-
(2006)
IEEE Transactions on Device and Materials Reliability
, vol.6
, Issue.3
, pp. 448-454
-
-
Cheung, K.P.1
-
3
-
-
84956123839
-
-
Fang, S., Murakawa, S., & McVittie, J. P. (1992). A new model for thin oxide degradation from wafer charging in plasma etching. In Proceedings of IEEE international electron devices meeting, San Francisco, CA, USA (pp. 61-64).
-
Fang, S., Murakawa, S., & McVittie, J. P. (1992). A new model for thin oxide degradation from wafer charging in plasma etching. In Proceedings of IEEE international electron devices meeting, San Francisco, CA, USA (pp. 61-64).
-
-
-
-
4
-
-
0002070177
-
How plasma etching damages thin gate oxides
-
Gabriel C., and McVittie J. How plasma etching damages thin gate oxides. Solid State Technology 35 6 (1992) 81-92
-
(1992)
Solid State Technology
, vol.35
, Issue.6
, pp. 81-92
-
-
Gabriel, C.1
McVittie, J.2
-
5
-
-
0028381753
-
Impact of polysilicon dry etching on 0.5 μm NMOS transistor performance: The presence of both plasma bombardment damage and plasma charging damage
-
Gu T., Okandan M., Awadelkarim O.O., Fonash S.J., Rembetski J., Aum P., et al. Impact of polysilicon dry etching on 0.5 μm NMOS transistor performance: The presence of both plasma bombardment damage and plasma charging damage. IEEE Electron Device Letters 15 2 (1994) 48-50
-
(1994)
IEEE Electron Device Letters
, vol.15
, Issue.2
, pp. 48-50
-
-
Gu, T.1
Okandan, M.2
Awadelkarim, O.O.3
Fonash, S.J.4
Rembetski, J.5
Aum, P.6
-
7
-
-
33244483403
-
Modeling silicon oxynitride etch microtrenching using genetic algorithm and neural network
-
Kim B., Bae J., and Lee B.T. Modeling silicon oxynitride etch microtrenching using genetic algorithm and neural network. Microelectronic Engineering 83 3 (2006) 513-519
-
(2006)
Microelectronic Engineering
, vol.83
, Issue.3
, pp. 513-519
-
-
Kim, B.1
Bae, J.2
Lee, B.T.3
-
8
-
-
0348014451
-
4 plasma using neural network
-
4 plasma using neural network. Applied Surface Science 222 1-4 (2004) 17-22
-
(2004)
Applied Surface Science
, vol.222
, Issue.1-4
, pp. 17-22
-
-
Kim, B.1
Kim, K.2
-
9
-
-
27744537729
-
Prediction of plasma processes using neural network and genetic algorithm
-
Kim B., and Bae J. Prediction of plasma processes using neural network and genetic algorithm. Solid-State Electronics 49 10 (2005) 1576-1580
-
(2005)
Solid-State Electronics
, vol.49
, Issue.10
, pp. 1576-1580
-
-
Kim, B.1
Bae, J.2
-
10
-
-
0032266286
-
-
Luchies, J. M., Simon, P., Kuper, F., & Maly, W. (1998). Relation between product yield and plasma process induced damage. In Third international symposium on plasma process-induced damage, Honolulu, HI, USA (pp. 7-10).
-
Luchies, J. M., Simon, P., Kuper, F., & Maly, W. (1998). Relation between product yield and plasma process induced damage. In Third international symposium on plasma process-induced damage, Honolulu, HI, USA (pp. 7-10).
-
-
-
-
12
-
-
0030685019
-
-
Nauka, K., Theil, J., Lagowski, J., Jastrzebski, L., & Sawtwhouk, S. (1997). A complete approach to the in-line monitoring of material defects introduced in dielectrics and Si by plasma etching. In Second international symposium on plasma process-induced damage, Monterey, CA, USA (pp. 127-130).
-
Nauka, K., Theil, J., Lagowski, J., Jastrzebski, L., & Sawtwhouk, S. (1997). A complete approach to the in-line monitoring of material defects introduced in dielectrics and Si by plasma etching. In Second international symposium on plasma process-induced damage, Monterey, CA, USA (pp. 127-130).
-
-
-
-
13
-
-
33746861058
-
Computational modeling of process induced damage during plasma clean
-
Rauf S., Haggag A., Mooda M., and Ventzek P.L.G. Computational modeling of process induced damage during plasma clean. Journal of Applied Physics 100 2 (2006) 023302-1-023302-9
-
(2006)
Journal of Applied Physics
, vol.100
, Issue.2
-
-
Rauf, S.1
Haggag, A.2
Mooda, M.3
Ventzek, P.L.G.4
-
14
-
-
0043255687
-
Plasma etching charge-up damage to thin oxides
-
Shin H., Jha N., Qian X.Y., Hills G.W., and Hu C. Plasma etching charge-up damage to thin oxides. Solid State Technology 36 8 (1993) 29-36
-
(1993)
Solid State Technology
, vol.36
, Issue.8
, pp. 29-36
-
-
Shin, H.1
Jha, N.2
Qian, X.Y.3
Hills, G.W.4
Hu, C.5
-
15
-
-
3142706664
-
Quantifying charging damage in gate oxides of antenna structures for WLR monitoring
-
Smeets D., and Fazekas J. Quantifying charging damage in gate oxides of antenna structures for WLR monitoring. Microelectronics Reliability 44 8 (2004) 1245-1250
-
(2004)
Microelectronics Reliability
, vol.44
, Issue.8
, pp. 1245-1250
-
-
Smeets, D.1
Fazekas, J.2
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