A Creep-Rupture Model for Two-Phase Eutectic Solders

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 11, Issue 3, 1988, Pages 284-290

  Wong, Boon ^a   Helling, Donald E ^a   Clark, Roy W ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE MECHANICS;

CREEP CRACK GROWTH PROPAGATION; CREEP-RUPTURE MODEL; MICROMECHANICS; SOLDER FAILURE PREDICTION; TWO-PHASE EUTECTIC SOLDERS;

SOLDERS;

EID: 0024070078     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.16655     Document Type: Article

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