Increasing mechanical strength of mesoporous silica thin films by addition of tetrapropylammonium hydroxide and refluxing processes

Thin Solid Films

Volumn 517, Issue 6, 2009, Pages 2039-2043

  Tsai, Cheng Tsung ^a   Lu, Hsin Yan ^a   Ting, Chih Yuan ^a   Wu, Wen Fa ^b   Wan, Ben Zu ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

Author keywords

Low dielectric constant; Low k film; Mechanical strength; Mesoporous; Reflux; Silica; Tetrapropylammonium hydroxide (TPAOH)

Indexed keywords

CERAMIC CAPACITORS; COLLOID CHEMISTRY; COLLOIDS; DIELECTRIC WAVEGUIDES; OXIDES; PERMITTIVITY; SILICA;

LOW DIELECTRIC CONSTANT; LOW-K FILM; MECHANICAL STRENGTH; MESOPOROUS; REFLUX; TETRAPROPYLAMMONIUM HYDROXIDE (TPAOH);

FILM PREPARATION;

EID: 58149103293     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.10.012     Document Type: Article

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