Experimental and modeling analysis on moisture induced failures in flip chip on flex interconnections with anisotropic conductive film

Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC

Volumn 2005, Issue , 2005, Pages 172-177

  Yin, C Y ^a   Lu, H ^a   Bailey, C ^a   Chan, Y C ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE/ FLEX INTERFACE; ANISOTROPIC CONDUCTIVE FILMS (ACF); FLIP-CHIP-ON-FLEX INTERCONNECTIONS; MACRO-MICRO MODELING METHOD;

ADHESIVES; ANISOTROPY; AUTOCLAVES; DIFFUSION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MOISTURE; THREE DIMENSIONAL;

CONDUCTIVE FILMS;

EID: 33744968651     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AGEC.2005.1452340     Document Type: Conference Paper

References (15)

1. Johan Liu et al, Conductive Advances For Electronics Packaging, Electron chemical Publications Ltd(London, U.K. 1999), pp. 234-248
2. Lei L. Mercodo, Jerry White, Vijay Sarihan and TienYu Tom Lee, "Failure Mechanism Study of Anisotropic Conductive Film (ACF) Packages", IEEE Trans on Components and Packaging Technologies, Vol. 26, No. 3, 2003, pp. 509-516
3. Zhou Wei, Low Siu Waf, Neo Yong Loo, Eng Meow Koon, Mark Huang "Studies on Moisture-induced Failures in ACF Interconnection", Electronics Packaging Technology Conference, 2002, pp133-138
4. J.F.J.M. Caers, X.J.Zhao, G.Lekens, R.Dreesen, K. Croes and E. H. Wong "Moisture Induced Failures in Flip Chip on Flex Interconnections using Anisotropic Conductive Adhesives", International IEEE Conference on the Business of Electronic Product Reliability and Liability, 2003
5. C.W. Tan, Y.C. Chan and N. H. Yeung "Effect of Autoclave Test on Anisotropic Conductive Joints" Microelectronics Reliability 43(2003): 279-285
6. Peter J. Opdahl "Anisotropic Conductive Film for Flipchip Applications: An Introduction", The Tutorial 05 on website: http://www.flipchips.com/tutorial05.html
7. C.Y.Yin, H. Lu, C. Bailey and Y.C. Chan, "Experimental and Modeling Analysis on the Reliability of Anisotropic Conductive Films", Electronic Components and Technology Conference, 2003.
8. th International Conference on, 2000 Page(s): 141-146
9. C.Y.Yin, et al, "The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications" Microelectronics Reliability 43(2003): 625-633
10. Johan Liu et al, Conductive Advances for Electronics Packaging. Electron chemical Publications Ltd(London, U.K. 1999), pp. 212-253
11. P. Gonon, A. Sylvestre, J. Teysseyre and C. Prior, 2001, "Combined Effects of Humidity and Thermal Stress on the Dielectric Properties of Epoxy-silica Composites", Materials Science and Engineering B83, pp.158-164
12. M. Ko and M. Kim, 1998, "Effect of Postmold Curing on Plastic 1C Package Reliability", Journal of Applied Polymer Science, 69 (11), pp.2187-2193
13. PHYSICA Multi-Physics Ltd, http://www.gre.ac.uk/~physica
14. D.C. Whalley, L. Chen, J. Liu "Modelling of the Anisotropic Adhesive Assem al Symposium on Electronic Packaging Technology, Beijing, August 2001, pp. 319-324, ISBN 0-7803-9811-4bly Process
15. E.H. Wong, Y. C. Teo, T.B. Lim, "Moisture Diffusion and Vapour Pressure Modelling of IC Packaging", Electronic Components and Technology Conference, 1998.