Analysis of current transients for voltage pulse-modulated surface processing: Application to anodic electro-dissolution of copper for electrochemical mechanical planarization

Journal of Materials Processing Technology

Volumn 209, Issue 3, 2009, Pages 1189-1198

  Sulyma, C M ^a   Goonetilleke, P C ^a   Roy, D ^a  

^a CLARKSON UNIVERSITY   (United States)

Author keywords

Anodising; Chemical etching; Copper; Interfaces; Solvent

Indexed keywords

CHEMICAL ANALYSIS; DISSOLUTION; ELECTROCHEMISTRY; ETCHING; EXPERIMENTS; HYDROGEN; HYDROGEN PEROXIDE; INTEGRATED CIRCUITS; METAL RECOVERY; MODULATION; NETWORKS (CIRCUITS); SOLVENTS; SURFACE REACTIONS; TRANSIENTS;

ACIDIC SOLUTIONS; ANODISING; APPLIED VOLTAGES; CHEMICAL ETCHING; COPPER LINES; COPPER SURFACES; CURRENT TRANSIENTS; ELECTROCHEMICAL MECHANICAL PLANARIZATION; ELECTROCHEMICAL PROCESSING; ELECTROCHEMICAL REMOVALS; EXPERIMENTAL DATUMS; EXPERIMENTAL SYSTEMS; EXPONENTIAL DECAYS; FARADAIC REACTIONS; INTERFACES; MECHANICAL POLISHING; METAL AND ALLOYS; MODULATED SURFACES; MODULATION TECHNIQUES; NEW PROCESSES; OXALIC ACIDS; POTENTIAL PULSES; QUANTITATIVE ANALYSES; RECTANGULAR SHAPES; SIMPLE CIRCUITS; SURFACE LAYERS; TYPICAL APPLICATIONS; VOLTAGE PULSES;

COPPER;

EID: 57949100752     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.03.022     Document Type: Article

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