Influence of Cu electroplating solutions on boron carbon nitride (BCN) film

Applied Surface Science

Volumn 255, Issue 6, 2009, Pages 3719-3722

  Aoki, Hidemitsu ^a   Hara, Makoto ^a   Masuzumi, Takuro ^a   Mazumder, Motaharu K ^a   Ooi, Naoki ^a   Watanabe, Daisuke ^a   Kimura, Chiharu ^a   Sugino, Takashi ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

BCN; Boron carbon nitride; Cu; Electroplating; Low k

Indexed keywords

CARBON NITRIDE; COPPER; ELECTROPLATING; HYDROPHOBICITY; INTEGRATED CIRCUIT INTERCONNECTS; LOW-K DIELECTRIC; NITRIDES; SOLUTION MINING; SURFACE CHEMISTRY; THERMAL DESORPTION SPECTROSCOPY;

BORON CARBON NITRIDE; COMPLEX DEVICES; CU ELECTROPLATING; ELECTRICAL MEASUREMENT; HYDROPHILIC SURFACES; HYDROPHOBIC SURFACES; PLATING SOLUTIONS; SURFACTANT ADSORPTION;

ELECTROPLATING SOLUTIONS;

EID: 57849159129     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.10.046     Document Type: Article

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