|
Volumn 17, Issue 4-5, 2008, Pages 628-632
|
Influence of moisture on BCN (low-K) film for interconnection reliability
|
Author keywords
BCN; Cu; Dielectric constant; Low K; Moisture; TDS; Water
|
Indexed keywords
BORON CARBIDE;
COPPER COMPOUNDS;
LEAKAGE CURRENTS;
LSI CIRCUITS;
MOISTURE;
POROUS MATERIALS;
WATER TREATMENT;
BORON CARBON NITRIDE (BCN);
CAPACITANCE-VERSUS-VOLTAGE (C-V);
CURRENT-VERSUS-VOLTAGE (I-V);
THERMAL DESORPTION SPECTROSCOPY (TDS);
DIELECTRIC FILMS;
|
EID: 42949091498
PISSN: 09259635
EISSN: None
Source Type: Journal
DOI: 10.1016/j.diamond.2007.08.043 Document Type: Article |
Times cited : (26)
|
References (16)
|