메뉴 건너뛰기




Volumn 17, Issue 4-5, 2008, Pages 628-632

Influence of moisture on BCN (low-K) film for interconnection reliability

Author keywords

BCN; Cu; Dielectric constant; Low K; Moisture; TDS; Water

Indexed keywords

BORON CARBIDE; COPPER COMPOUNDS; LEAKAGE CURRENTS; LSI CIRCUITS; MOISTURE; POROUS MATERIALS; WATER TREATMENT;

EID: 42949091498     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2007.08.043     Document Type: Article
Times cited : (26)

References (16)
  • 10
    • 42949118392 scopus 로고    scopus 로고
    • H. Aoki, H. Shima, C. Kimura, T. Sugino, Diamond and Relat. Mater. (in press).
    • H. Aoki, H. Shima, C. Kimura, T. Sugino, Diamond and Relat. Mater. (in press).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.