Effect of moisture adsorption on the properties of porous-silica ultralow-k films

Microelectronic Engineering

Volumn 83, Issue 11-12, 2006, Pages 2126-2129

  Uchida, Y ^a   Hishiya, S ^a   Fujii, N ^a   Kohmura, K ^a   Nakayama, T ^a   Tanaka, H ^a   Kikkawa, T ^b,c  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^c HIROSHIMA UNIVERSITY   (Japan)

Author keywords

Cu interconnects; Hydrophobicity; Low k material; Moisture uptake; Porous silica

Indexed keywords

ADSORPTION; CHEMICAL BONDS; HYDROPHOBICITY; MOISTURE; PERMITTIVITY; POROUS MATERIALS; SILICA;

CU INTERCONNECTS; LOW-K MATERIALS; MOISTURE UPTAKE; POROUS SILICA; THERMAL DESORPTION;

DIELECTRIC FILMS;

EID: 33751309379     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.09.018     Document Type: Article

References (9)

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