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Volumn 17, Issue 4-5, 2008, Pages 669-672
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Characterization of BCN film after wet process for interconnection integration
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Author keywords
BCN; FTIR; Interconnection; Low dielectric constant; LowK; Wet process; XPS
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Indexed keywords
BORON NITRIDE;
CARBON NITRIDE;
FOURIER TRANSFORM INFRARED SPECTROSCOPY;
INTERCONNECTION NETWORKS;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
X RAY PHOTOELECTRON SPECTROSCOPY;
BORON CARBON NITRIDE (BCN);
INTERCONNECTION INTEGRATION;
LOW DIELECTRIC CONSTANT;
WET PROCESS;
THIN FILMS;
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EID: 42949177658
PISSN: 09259635
EISSN: None
Source Type: Journal
DOI: 10.1016/j.diamond.2007.10.029 Document Type: Article |
Times cited : (10)
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References (17)
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