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Volumn 46, Issue 4 B, 2007, Pages 2006-2010

Ag diffusion in low-k materials (BCN and SiOC) and its challenges for future interconnection

Author keywords

BCN film; Copper; GDS; Interconnection; Low k; Silver diffusion; SiOC

Indexed keywords

CURRENT VOLTAGE CHARACTERISTICS; DIFFUSION; GLOW DISCHARGES; LEAKAGE CURRENTS; OPTICAL EMISSION SPECTROSCOPY; PERMITTIVITY;

INTERCONNECTIONS; LEAKAGE CURRENT VARIATION; SILVER DIFFUSION;

DIELECTRIC FILMS;

EID: 34547913151 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.46.2006 Document Type: Article

Times cited : (16)

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