Deep plasma etching of glass for fluidic devices with different mask materials

Journal of Micromechanics and Microengineering

Volumn 18, Issue 6, 2008, Pages

  Kolari, Kai ^a   Saarela, Ville ^b   Franssila, Sami ^b  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b Micro and Nanosciences Laboratory   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; ATMOSPHERIC IONIZATION; ATMOSPHERIC PRESSURE; ETCHING; FLUIDIC DEVICES; FUSED SILICA; GLASS; PLASMA ETCHING; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICON; SILICON WAFERS;

ATMOSPHERIC PRESSURE CHEMICAL IONIZATIONS; DEEP PLASMA ETCHINGS; DEEP REACTIVE ION ETCHINGS; ETCH MASKS; MASK MATERIALS; VERTICAL STRUCTURES;

AMORPHOUS SILICON;

EID: 57249101899     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/6/064010     Document Type: Conference Paper

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