Isotropic etching of silicon in fluorine gas for MEMS micromachining

Journal of Micromechanics and Microengineering

Volumn 17, Issue 2, 2007, Pages 384-392

  Arana, Leonel R ^a   De Mas, Nuria ^a   Schmidt, Raymond ^a   Franz, Aleksander J ^a   Schmidt, Martin A ^a   Jensen, Klavs F ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE; ELECTROCHEMICAL ETCHING; FLUORINE; MEMS; MICROMETERS; SILICON NITRIDE;

ETCHING PROCESS; FLUORINE GAS; ISOTROPIC ETCHING; SILICON MICROMACHINING;

MICROMACHINING;

EID: 34248993616     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/2/026     Document Type: Article

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