Stress analysis on ultra thin ground wafers

Journal of Integrated Circuits and Systems

Volumn 3, Issue 2, 2008, Pages 83-89

  Teixeira, Ricardo C ^a,b   De Munck, Koen ^b   De Moor, Piet ^b   Baert, Kris ^b   Swinnen, Bart ^b   Van Hoof, Chris ^a,b   Knüttel, Alexander ^c  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b IMEC   (Belgium)

^c Isis Sentronics   (Germany)

Author keywords

Grinding; Stoney's formula; Stress; Wafer thinning

Indexed keywords

EID: 56849116768     PISSN: 18071953     EISSN: 18720234     Source Type: Journal    
DOI: None     Document Type: Article

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