Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 15, Issue 6, 2005, Pages 1285-1289

  Xue, Song Bai ^a   Yu, Sheng Lin ^b   Wang, Xu Yan ^a   Liu, Lin ^a   Hu, Yong Fang ^a   Yao, Li Hua ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Lead free solder; Liquidus; Sn Ag Cu Ce alloy; Solidus; Wetting time

Indexed keywords

CERIUM ALLOYS; COPPER ALLOYS; LASER BEAMS; POWDERS; RARE EARTH ELEMENTS; SILVER ALLOYS; TEMPERATURE; TIN ALLOYS;

LEAD-FREE SOLDER; LIQUIDUS; SOLDERABILITIES; SOLIDUS; WETTING TIME;

SOLDERING ALLOYS;

EID: 33644845267     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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