A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu

Scripta Materialia

Volumn 54, Issue 9, 2006, Pages 1557-1562

  Gourlay, C M ^a   Nogita, K ^a   McDonald, S D ^a   Nishimura, T ^b   Sweatman, K ^b   Dahle, A K ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b Nihon Superior Co Ltd   (Japan)

Author keywords

Coherency; Eutectic solidification; Lead free solder; Soldering

Indexed keywords

EUTECTICS; NICKEL; RHEOLOGY; SOLDERING; SOLDERING ALLOYS; SOLIDIFICATION;

COHERENCY; EUTECTIC SOLIDIFICATION; LEAD-FREE SOLDER;

TIN ALLOYS;

EID: 33344474451     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.01.025     Document Type: Article

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