Electroless copper deposition by non-isothermal deposition technology

Materials Chemistry and Physics

Volumn 113, Issue 1, 2009, Pages 303-308

  Sung, Y ^a   Chou, Y H ^b   Hwu, W H ^b   Fan, Y C ^b   Cheng, J L ^b   Ger, M D ^b  

^a CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL DEFENSE UNIVERSITY   (Taiwan)

Author keywords

Cannizzaro reaction; Copper; Electroless; Non isothermal deposition

Indexed keywords

ALDEHYDES; ANNEALING; CHEMICAL REACTIONS; COPPER; COPPER DEPOSITS; COPPER PLATING; DEPOSITION RATES; ELECTROLESS PLATING; RATE CONSTANTS;

ANNEALING TREATMENTS; BATH LIVES; CANNIZZARO REACTION; CANNIZZARO REACTIONS; COPPER CRYSTALS; DEPOSITION TECHNOLOGIES; ELECTROLESS; ELECTROLESS COPPER DEPOSITIONS; ELECTROLESS COPPERS; HIGH DEPOSITION RATES; ISOTHERMAL METHODS; NON-ISOTHERMAL DEPOSITION; NOVEL PROCESSES;

DEPOSITION;

EID: 56749154444     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2008.07.075     Document Type: Article

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