Deformation of monocrystalline silicon under nanoscratching

Advanced Materials Research

Volumn 41-42, Issue , 2008, Pages 15-19

  Wu, Y Q ^a   Huang, H ^a   Zou, J ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

Author keywords

Deformation mechanism; Nanoscratch; Silicon; TEM

Indexed keywords

CRYSTALLINE MATERIALS; DEFORMATION; FAILURE (MECHANICAL); HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MONOCRYSTALLINE SILICON; SILICON; STRUCTURAL INTEGRITY; TRANSMISSION ELECTRON MICROSCOPY;

APPLIED LOADS; CRYSTALLINE REGIONS; CRYSTALLINE SI; DAMAGED REGION; DEFORMATION MECHANISM; DENSITY OF DISLOCATION; NANO-SCRATCH; NANOSCRATCHING;

AMORPHOUS SILICON;

EID: 56349083226     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/amr.41-42.15     Document Type: Conference Paper

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