Development of low-cost micro-thermoelectric coolers utilizing MEMS technology

Sensors and Actuators, A: Physical

Volumn 148, Issue 1, 2008, Pages 176-185

  Huang, I Yu ^a   Lin, Jr Ching ^a   She, Kun Dian ^a   Li, Ming Chan ^a   Chen, Jiann Heng ^b   Kuo, Jin Shun ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NATIONAL CHI NAN UNIVERSITY   (Taiwan)

Author keywords

Bridge type polysilicon TEC; Column type telluride TEC; MEMS like electrochemical process; Micro thermoelectric cooler; Surface micromachining

Indexed keywords

COMPOSITE MICROMECHANICS; COOLING; COOLING SYSTEMS; FABRICATION; MICROMACHINING; POLYCRYSTALLINE MATERIALS; POLYSILICON; SURFACE MICROMACHINING; THERMAL CONDUCTIVITY; THERMOELECTRIC EQUIPMENT; THERMOELECTRIC REFRIGERATION;

BRIDGE-TYPE; COOLING PERFORMANCE; CROSS-SECTION AREA; ELECTROCHEMICAL PROCESS; LOW DRIVING CURRENTS; MAXIMUM TEMPERATURE DIFFERENCES; MICRO THERMOELECTRIC COOLERS; THERMAL CONDUCTANCE;

THERMOELECTRICITY;

EID: 55349142096     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2008.07.017     Document Type: Article

References (29)

1. H.T. Chien, D.S. Lee, P.P. Ding, S.L. Chu, P.H. Chen, Disk-shaped miniature heat pipe (DMHP) with radiating micro grooves for a TO Can laser diode package, IEEE Trans. Comp. Pack. Technol. 26 (2003) 569-574.
2. R. Hopkins, A. Faghri, D. Khrustalev, Flat miniature heat pipes with micro capillary grooves, J. Heat Transfer 121 (1999) 102-109.
3. M. Le Berre, S. Launay, V. Sartre, M. Lallemand, Fabrication and experimental investigation of silicon micro heat pipes for cooling electronics, J. Micromech. Microeng. 13 (2003) 436-441.
4. F.J. Disalvo, Thermoelectric cooling and power generation, Science 285 (1999) 703-706.
5. D.M. Rowe, CRC Handbook of Thermoelectrics, CRC Press, Boca Raton, FL, 1995.
6. A.W. Sloman, P. Buggs, J. Molloy, D.A. Stewart, Microcontroller-based driver to stabilize the temperature of an optical stage to within 1 mK in the range 4-38°C, using a Peltier heat pump and a thermistor sensor, Meas. Sci. Technol. 7 (1996) 1653-1664.
7. G. Festa, B. Neri, Thermally regulated low-noise, wideband, I/V converter, using Peltier heat pumps, IEEE Trans. Instrum. Meas. 43 (1994) 900-905.
8. A. Miner, A. Majumdar, Thermo-electro-mechanical refrigeration based on transient thermoelectric effects, Int. Conf. Thermoelectrics (1999) 27-30.
9. M.R. Holman, S.J. Rowland, Design and development of a new cryosurgical instrument utilizing the Peltier thermoelectric effect, J. Med. Eng. Technol. 21 (1997) 106-110.
10. D.D.L. Wijngaards, S.H. Kong, M. Bartek, R.F. Wolffenbuttel, Design and fabrication of on-chip integrated polySiGe and polySi Peltier devices, Sens. Actuators A85 (2000) 316-323.
11. G. Min, D.M. Rowe, F. Völklein, Integrated thin film thermoelectric cooler, IEEE Electron. Lett. 34 (1998) 222-223.
12. G. Min, D.M. Rowe, Cooling performance of integrated thermoelectric microcooler, Solid-State Electron. 43 (1999) 923-929.
13. C. LaBounty, A. Shakouri, J.E. Bowers, Design and characterization of thin film microcoolers, J. Appl. Phys. 89 (2001) 4059-4064.
14. X. Fan, E. Croke, C.C. Ahn, S. Huxtable, A. Majumdar, A. Shakouri, SiGeC/Si super-lattice microcoolers, Appl. Phys. Lett. 78 (2001) 1580-1582.
15. 3 (N) thin film thermocouple, Thin Solid Films 408 (2002) 270-274.
16. R. Venkatasubramanian, E. Siivola.T. Colpitts, B. O'Quinn, Thin-film the rmoelectric devices with high room-temperature figures of merit, Nature 413 (2003) 597-602.
17. G.J. Snyder, J.R. Lim, C.K. Huang, J.P. Fleurial, Thermoelectric microdevice fabricated by a MEMS-like electrochemical process, Nature Mater. Lett. 2 (2003) 528-531.
18. L.W. da Silva, M. Kaviany, Fabrication and measured performance of a first-generation microthermoelectric cooler, J. Microelectromech. Syst. 14 (2005) 1110-1117.
19. I.Y. Huang, M.J. Li, G.Y. Zeng, K.D. She, Design and fabrication of a column-type microthermoelectric cooler with bismuth telluride and antimony telluride pillars by using electroplating and MEMS technology, in: Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineering and Molecular Systems (IEEE-NEMS 2007), 2007, pp. 749-752.
20. Y. Zhang, J. Christofferson, A. Shakouri, G. Zeng, J.E. Bowers, E.T. Croke, On-chip high speed localized cooling using superlattice microrefrigerators, IEEE Trans. Comp. Pack. Technol. 29 (2006) 395-401.
21. D.J.J. Yao, In-plane MEMS thermoelectric microcooler, Ph.D. Dissertation, UCLA, 2001.
22. J.C. Lin, H.J.H. Chen, I.Y. Huang, S.R.S. Huang, A poly-Si thermoelectric cooling device fabricated by surface micromachining technology, in: Proceedings of the 12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS'03, 2003, pp. 1084-1087.
23. G.J. Snyder, M. Soto, R. Alley, D. Koester, B. Conner, Hot spot cooling using embedded thermoelectric coolers, in: Proceedings of the 22nd IEEE Semiconductor Thermal Measurement, Modeling, and Management Symposium, SEMI-THERM 22, 2006, pp. 135-143.
24. C.J. LaBounty, Heterostructure integrated thermionic cooling of optoelectronic devices, Ph.D. Dissertation, UCSB, 2001.
25. G. Chen, B.Yang, W.L. Liu,T. Borca-Tasciuc, D. Song, D. Achimov, Thermoelectric property characterization of low-dimensional structures, in: Proceedings of the 20th International Conference on Thermoelectrics, 2001, pp. 30-34.
26. J.R. Lim, G.J. Snyder, C.-K. Huang, J.A. Herman, M.A. Ryan, J.-P. Fleurial, Thermoelectric microdevice fabrication process and evaluation at the Jet Propulsion Laboratory (JPL), in: Proceedings of the 21st International Conference on Thermoelectrics, 2002, pp. 535-539.
27. A.D. McConnell, S. Uma, K.E. Goodson, Thermal conductivity of doped polysilicon layers, J. Microelectromech. Syst. 10 (2001) 360-369.
28. C.E. Raudzis, F. Schatz, D. Wharam, Extending the 3ω method for thin-film analysis to high frequencies, J. Appl. Phys. 93 (2003) 6050-6055.
29. 2 thin film, Rev. Sci. Instrum. 79 (2008) 054902.