Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film

Review of Scientific Instruments

Volumn 79, Issue 5, 2008, Pages

  Chien, Heng Chieh ^a,b   Yao, Da Jeng ^b   Huang, Mei Jiau ^c   Chang, Tien Yao ^c  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^c NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC HEATING; HEAT RESISTANCE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICA; THERMAL CONDUCTIVITY;

SILICON SUBSTRATE; SILICON SYSTEMS;

THIN FILMS;

EID: 44649122694     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2927253     Document Type: Article

References (22)

1. D. G. Cahill, W. K. Ford, and K. E. Goodson, J. Appl. Phys. 93, 793 (2003).
2. K. E. Goodson and M. I. Flik, Appl. Mech. Rev. 47, 101 (1994).
3. D. G. Cahill, Microscale Thermophys. Eng. 1, 85 (1997).
4. J. E. Graebner, J. A. Mucha, and L. Seibles, J. Appl. Phys. 71, 3143 (1992).
5. Y. C. Tai, C. H. Mastrangelo, and R. S. Muller, J. Appl. Phys. 63, 1442 (1988).
6. E. P. Visser, E. H. Versteegen, and J. P. Enckevort, J. Appl. Phys. 71, 3238 (1992).
7. J. E. Graebner, S. Jin, and G. W. Kammlott, J. Appl. Phys. 71, 5353 (1992).
8. E. T. Swartz and R. O. Pohl, Appl. Phys. Lett. 51, 2200 (1987).
9. K. E. Goodson, M. I. Flik, and L. T. Su, J. Heat Transfer 116, 317 (1994).
10. Y. S. Touloukian, R. W. Powell, and C. Y. Ho, Thermal Conductivity: Metallic Elements and Alloys (IFI/Plenum, New York, 1970).
11. J. A. J. Griffin, F. R. Brotzen, and P. J. Loos, J. Appl. Phys. 76, 4007 (1994).
12. J. A. J. Griffin, F. R. Brotzen, and P. J. Loos, J. Appl. Phys. 75, 3761 (1994).
13. S. M. Lee and D. G. Cahill, J. Appl. Phys. 81, 2590 (1997).
14. Y. S. Touloukian, R. W. Powell, and C. Y. Ho, Thermal Conductivity: Nonmetallic Solids (IFI/Plenum, New York, 1970).
15. C. E. Raudzis and F. Schatz, J. Appl. Phys. 93, 6050 (2003).
16. T. Yamane, N. Nagai, and S. Katayama, J. Appl. Phys. 91, 9772 (2002).
17. J. H. Kim, A. Feldman, and D. Novotny, J. Appl. Phys. 86, 3959 (1999).
18. S. Govorkov, W. Ruerman, and M. W. Horn, Rev. Sci. Instrum. 68, 3828 (1997).
19. O. W. Käding, H. Shurk, and K. E. Goodson, Appl. Phys. Lett. 65, 1629 (1994).
20. B. Y. Tsui, C. C. Yang, and K. L. Fang, IEEE Trans. Electron Devices 51, 20 (2004).
21. Y. S. Ju, M. T. Hung, and T. Usui, J. Heat Transfer 128, 919 (2006).
22. A. Majumdar and P. Reddy, Appl. Phys. Lett. 84, 4768 (2004).