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Volumn 2, Issue , 2003, Pages 1084-1087
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A poly-Si thermoelectric cooling device fabricated by surface micromachining technology
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Author keywords
Bridge circuits; CMOS technology; Electronics cooling; Fabrication; Microelectronics; Micromachining; Monolithic integrated circuits; Tellurium; Thermoelectric devices; Thermoelectricity
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Indexed keywords
ACTUATORS;
BRIDGE CIRCUITS;
CMOS INTEGRATED CIRCUITS;
COMPOSITE MICROMECHANICS;
COOLING;
FABRICATION;
MICROELECTRONICS;
MICROMACHINING;
MICROSYSTEMS;
MONOLITHIC INTEGRATED CIRCUITS;
PELTIER EFFECT;
POLYCRYSTALLINE MATERIALS;
SOLID-STATE SENSORS;
SURFACE MICROMACHINING;
TELLURIUM;
TELLURIUM COMPOUNDS;
THERMOELECTRICITY;
TRANSDUCERS;
CMOS TECHNOLOGY;
ELECTRONICS COOLING;
SACRIFICIAL OXIDE;
SURFACE MICROMACHINING TECHNOLOGY;
SURROUNDING ENVIRONMENT;
THERMAL CONDUCTION;
THERMOELECTRIC COOLING DEVICES;
THERMOELECTRIC DEVICES;
ELECTRONIC COOLING;
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EID: 84944714876
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/SENSOR.2003.1216957 Document Type: Conference Paper |
Times cited : (3)
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References (10)
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