Disk-Shaped Miniature Heat Pipe (DMHP) With Radiating Micro Grooves for a TO Can Laser Diode Package

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 569-574

  Chien, Hsin Tang ^a   Lee, Da Sheng ^a   Ding, Pei Pei ^a   Chiu, Shiu Lin ^a   Chen, Ping Hei ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Heat spreader; Micro groove heat pipe; TO can laser diode packaging

Indexed keywords

ALUMINUM; COPPER; HEAT RESISTANCE; OXYGEN; PACKAGING; SEMICONDUCTOR LASERS;

HEAT SPREADER;

HEAT PIPES;

EID: 0142195947     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817648     Document Type: Article

References (12)

1. D. Lewis, S. Dilhaire, T. Phan, V. Quintard, V. Hornung, and W. Claeys, "Modeling and experimental study of heat deposition and transport in a semiconductor laser diode," Microelectron. J., vol. 29, pp. 171-179, 1998.
2. R. B. Mark and D. L. Robert, "Compact laser-diode sources for optical inspection probes," IEEE Trans. Ind. Applicat., vol. 25, pp. 652-657, July/Aug. 1989.
3. T. P. Cotter, "Principles and prospects for micro heat pipe," in Proc. 5th Int. Heat Pipe Conf., Tsukuba, Japan, 1984. pp. 328-335.
4. E. Hammel, C. Nagl, J. Nicolics, and O. Hanreich, "High thermal performance silicon heat spreader with microwhisker structure," in Proc. IEEE/CPTM Int. Electron. Manufact. Technol. Symp., 1999, pp. 426-432.
5. R. Ponnappan, "A novel micro-capillary groove-wick miniature heat pipe," in Proc. AIAA'00, 2000, Paper 2000-2947, pp. 818-826.
6. Z. J. Zuo, M. T. North, and K. L. Wert, "High heat flux heat pipe mechanism for cooling of electronics," IEEE Trans. Comp. Packag. Technol. vol. 24. pp. 220-225, June 2001.
7. K. Take, Y. Furukawa, and S. Ushioda, "Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers," IEEE Trans. Comp. Packag. Technol., vol. 23, pp. 80-85, Mar. 2000.
8. K. Take and R. L. Webb, "Thermal performance of integrated plate heat pipe with a heat spreader," ASME J. Electron. Packag., vol. 123, pp. 189-195, 2001.
9. G. P. Peterson, An Introduction to Heat Pipes-Modeling, Testing, and Applications. New York: Wiley, 1994.
10. A. Faghri, Heat Pipe Science and Technology. London, U.K.: Taylor & Francis, 1995.
11. G. P. Peterson and J. M. Ha, "Capillary performance of evaporating flow in micro grooves: An approximate analytical approach and experimental investigation," ASME J. Heat Transfer, vol. 120, pp. 743-751, 1998.
12. J. G. Collier and J. R. Thome, Convective Boiling and Condensation. Oxford, U.K.: Clarendon Press, 1996.