Design and fabrication of integrated power inductor based on silicon molding technology

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn , Issue , 2007, Pages 1612-1618

  Wang, Mingliang ^a   Batarseh, Issa ^b   Ngo, Khai D T ^c   Xie, Huikai ^a  

^a J Crayton Pruitt Family Department of Biomedical Engineering   (United States)

^b University of Central Florida   (United States)

^c Virginia Polytechnic Institute and State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER PLATING; ELECTRIC RESISTANCE; ELECTROCHEMISTRY; ELECTROPLATING; LITHOGRAPHY; MAGNETIC CIRCUITS; MAGNETIC CORES; MAGNETIC DEVICES; MAGNETIC LEAKAGE; MAGNETIC MATERIALS; METALLIZING; MIXING; MONOLITHIC INTEGRATED CIRCUITS; NONMETALS; OPTICAL DESIGN; POWDERS; POWER ELECTRONICS; SILICON; SILICON WAFERS; SINTERING; TRANSFORMER WINDINGS;

COPPER WINDINGS; FABRICATION PROCESSES; HIGH CURRENT DENSITIES; HIGH RESISTIVITY; HIGH-POWER DENSITY; HIGH-TEMPERATURE SINTERING; INTEGRATED POWER; LOW LOSSES; LOW-PERMEABILITY; MONOLITHIC INTEGRATIONS; NEW PROCESSES; PORTABLE ELECTRONICS; SATURATION CURRENTS; SILICON SUBSTRATES; SILICON TRENCHES; SILICON-BASED;

WINDING;

EID: 48349134567     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2007.4342237     Document Type: Conference Paper

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