Preparation, microstructure, and property characterizations of fluorinated polyimide-organosilicate hybrids

European Polymer Journal

Volumn 44, Issue 11, 2008, Pages 3482-3492

  Chiang, Tzu Hsuan ^a   Liu, Szu Ling ^b   Lee, Shyh Yang ^b   Hsieh, Tsung Eong ^b  

^a Chin Min Institute of Technology 110   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Electrical properties; Microstructure; PI organosilicate hybrids; Sol gel process

Indexed keywords

ABS RESINS; AMINES; CERAMIC CAPACITORS; COLLOIDS; COUPLING AGENTS; DIELECTRIC WAVEGUIDES; ELECTRIC PROPERTIES; ELECTRON SPIN RESONANCE SPECTROSCOPY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; FOURIER TRANSFORMS; FUNCTIONAL GROUPS; GELATION; GELS; INFRARED SPECTROSCOPY; LEAKAGE CURRENTS; MAGNETIC RESONANCE; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; NITROGEN COMPOUNDS; NUCLEAR MAGNETIC RESONANCE; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; ORGANIC COMPOUNDS; PERMITTIVITY; PHASE SEPARATION; POLYIMIDES; POLYMERS; RESONANCE; SILANES; SILICA; SILICA GEL; SILICON COMPOUNDS; SOL-GEL PROCESS; SOL-GELS; SOLS; SPECTROSCOPIC ANALYSIS; SPIN COATING; THERMOANALYSIS; THERMODYNAMIC STABILITY;

ABSORPTION BANDS; AMINO PROPYL TRIETHOXY SILANES; BRIDGING BONDS; CLOSED FORMS; CURRENT DENSITY MEASUREMENTS; DIELECTRIC APPLICATIONS; DIELECTRIC CONSTANTS; DIELECTRIC MEASUREMENTS; DIETHOXYDIMETHYLSILANE; ELECTRICAL PROPERTIES; FLUORINATED POLIES; FLUORINATED POLYIMIDES; FOURIER-TRANSFORM; HIGH SI CONTENTS; INORGANIC COMPONENTS; NETWORK FORMATIONS; ORGANO SILICATES; PI-ORGANOSILICATE HYBRIDS; POLYMERIC MATRIXES; POROSITY CALCULATIONS; PROPERTY CHARACTERIZATIONS; SI CONTENTS; SILANE COUPLING AGENTS; SILICA STRUCTURES; SILICA XEROGELS; SINGLE BONDS; SYNTHESIS OF; TETRAETHOXYSILANE; THERMAL ANALYSIS; THERMAL STABILITIES; ULTRAFINE;

SILICON;

EID: 55149091984     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eurpolymj.2008.08.028     Document Type: Article

References (47)

1. Wary J., Olson R., and Beach W. Semicond Int 19 6 (1996) 211-216
2. Jin Y., Ajmera P.K., Lee G.S., and Singh V. J Electronic Mater 34 9 (2005) 1193-2105
3. Kim S.H., Moon H.S., Woo S.G., and Ahn J. Jpn J Appl Phys Part I 38 12B (1999) 7122-7125
4. Aziz R., and Beamish J.C. Circuit World 24 2 (1998) 24-33
5. Huang J., Xiao Y., Mya K.Y., Liu X., He C., Dai J., et al. J Mater Chem 14 19 (2004) 2858-2863
6. Stevens N.S.M., and Rezac M.E. Polym 40 15 (1999) 4289-4298
7. Ahmad Z., and Mark J.E. Chem Mater 13 10 (2001) 3320-3330
8. Kim Y., Kang E., Kwon Y.S., Cho W.J., Cho C., Chang M., et al. Synth Met 85 1-3 (1997) 1399-1400
9. Ree M., Goh W.H., and Kim Y. Polym Bull 35 1-2 (1995) 215-222
10. Hedrick J.L., Cha H.J., Miller R.D., Yoon D.Y., and Brown H.R. Macromolecules 30 26 (1997) 8512-8515
11. Kioul A., and Mascia L. J Non-Cryst Solids 175 2-3 (1994) 169-186
12. van Bommel M.J., Bernards T.N.M., and Boonstra A.H. J Non-Cryst Solids 128 3 (1991) 231-242
13. Jang K., and Kim H. J Sol-gel Sci Techn 41 1 (2007) 19-24
14. Duran A., Serna C., Fornes V., and Navarro J.M.F. J Non-Cryst Solids 82 1-3 (1986) 69-77
15. Li W.S., Shen Z.X., Zheng J.Z., and Tang S.H. Appl Spectrosc 52 7 (1998) 985-989
16. Atkins G.R., Krolikowska R.M., and Samoc A. J Non-Cryst Solids 265 3 (2000) 210-220
17. Park H.B., and Lee Y.M. Adv Mater 17 4 (2005) 477-483
18. Olejniczak Z., Łe{ogonek}czka M., Cholewa-Kowalska K., Wojtach K., Rokita M., and Mozgawa W. J Mol Struct 744-747 1-3 (2005) 465-471
19. Chiang C.L., and Ma C.C.M. Polym Degrad Stabil 83 2 (2004) 207-214
20. Barsbay M., Can H.K., Güner A., and Rzaev Z.M.O. Polym Adv Technol 16 1 (2005) 32-37
21. Zhang Q.G., Liu Q.L., Jiang Z.Y., and Chen Y. J Membrane Sci 287 2 (2007) 237-245
22. Capadona L.A., Meador M.A.B., Alunni A., Fabrizio E.F., Vassilaras P., and Leventis N. Polymer 47 16 (2006) 5754-5761
23. Nandi M., and Conklin J.A. Chem Mater 3 1 (1991) 201-206
24. Liu W.D., Zhu B.K., Zhang J., and Xu Y.Y. Polym Adv Technol 18 7 (2007) 522-528
25. Zhang J., Zhu B.K., Chu H.J., and Xu Y.Y. J Appl Polym Sci 97 1 (2005) 20-24
26. Yu S., Wong T.K.S., Hu X., and Pita K. Thin Solid Films 462-463 1-2 (2004) 311-315
27. Hong J.K., Kim H.R., and Park H.H. Thin Solid Films 332 1-2 (1998) 449-454
28. Hrubesh L.W., Keene L.E., and Latorre V.R. J Mater Res 8 7 (1993) 1736-1741
29. Jo M.H., Hong J.K., Park H.H., Kum J.J., and Hyun S.H. Microelectron Eng 33 1-4 (1997) 343-348
30. Henning S., and Svensson L. Phys Scripta 23 4B (1981) 697-702
31. Yu S., Wong T.K.S., Hu X., and Pita K. Thin Solid Films 462-463 (2004) 311-315
32. Garrou P., and Turlik I. In: Messner G., Turlik I., Blade J.W., and Garrou P.E. (Eds). Thin film multichip modulus (1992), International Society of Hybrid Microelectronics, Reston, VA, USA 93-155
33. Plawsky J.L., Achanta R., Cho W., Rodriguez O., Saxena R., and Gill W.N. In: Baklanov M., Green M., and Maex L. (Eds). Dielectric films for advanced microelectronics (2007), John Wiley & Sons, West Sussex, England 137-190
34. Lee Y.K., and Murarka S.P. J Mater Sci 33 16 (1998) 4105-4109
35. Sugitani S, Matsuzaki H, Enoki T. Characteristics of low-k film deposited by plasma-enhanced CVD using a liquid BCB source. 2003 International Conf Compound Semiconductor Mfg. May 19-22, 2003. Scottsgale AZ, USA. Session 4-4.
36. Chang T.C., Tsai T.M., Liu P.T., Chen C.W., and Tseng T.Y. Thin Solid Films 469-470 (2004) 383-387
37. Liu P.T., Chang T.C., Yan S.T., Li C.H., and Sze S.M. J Electrochem Soc 150 2 (2003) F7-F10
38. Chang T.C., Liu P.T., Tsai T.M., Yeh F.S., Tseng T.Y., Tsai M.S., et al. Jpn J Appl Phys Part I 40 5A (2001) 3143-3146
39. Yin G., Ning Z., Yuan Q., Ye C., and Xin Y. J Am Ceram Soc 90 6 (2007) 1943-1945
40. Chang T.C., Mor Y.S., Liu P.T., Tsai T.M., Chen C.W., Sze S.M., et al. Thin Solid Films 398-399 (2001) 637-640
41. Kim K., Kwon D., and Lee D.S. Thin Solid Films 332 (1998) 369-374
42. Lee M.K., Shih C.M., Chang S.M., Wang H.C., and Huang J.J. Jpn J Appl Phys 44 6 (2005) L220-L223
43. Yu S., Wong T.K.S., Hu X., and Goh T.K. Thin Solid Films 462-463 (2004) 306-310
44. Jain A., Rogojevic S., Ponoth S., Agarwal N., Matthew I., Gill W.N., et al. Thin Solid Films 398-399 (2001) 513-522
45. Yu S., Wong T.K.S., and Hu X. J Sol-gel Sci Tech 29 1 (2004) 57-62
46. Lin Q., Cohen S.A., Gignac L., Herbst B., Klaus D., Simonyi E., et al. J Polym Sci Part B Polym Phys 45 12 (2007) 1482-1493
47. Jiang L.Y., Leu C.M., and Wei K.H. Adv Mater 14 6 (2003) 426-429