Electrical properties of silica-polyimide composite dielectric thin films prepared via sol-gel reaction and thermal imidization

Synthetic Metals

Volumn 85, Issue 1-3, 1997, Pages 1399-1400

  Kim, Y ^a   Kang, E ^a   Kwon, Y S ^c   Cho, W J ^a   Cho, C ^a   Chang, M ^a   Ree, M ^b   Chang, T ^b   Ha, C S ^a  

^a Pusan National University   (South Korea)

^b Pohang University of Science and Technology (POSTECH)   (South Korea)

^c Dong A University   (South Korea)

Author keywords

High temperature methods for material preparation; Insulating films; Sol gel methods; Spin casting

Indexed keywords

CAPACITANCE MEASUREMENT; DIELECTRIC FILMS; ELECTRIC CONDUCTIVITY OF SOLIDS; PERMITTIVITY; POLYIMIDES; SILICA; SOL-GELS;

THERMAL IMIDIZATION PROCESS;

THIN FILMS;

EID: 0031071925     PISSN: 03796779     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0379-6779(97)80291-3     Document Type: Article

References (5)

1. K.L. Mittal, Eds., Polyimide:Synthesis, Characterization and Applications, Plenum, New York (1983).
2. R.R. Tummala and E.J. Rymaszewski, Eds., Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York (1989).
3. M. Ree, C.W. Chu, and M.J. Goldberg, J.Appl. Phys., 75 (1994), 1410.
4. C.E. Sroog, Prog. Polym.Sci., 16 (1991), 561.
5. Y. Kim, Ph.D. dissertation, Pusan National University, Pusan, Korea(1996).