Reliability evaluation for copper/low-k structures based on experimental and numerical methods

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 3, 2008, Pages 455-463

  Che, Fa Xing ^a,b   Zhang, Xiaowu ^c   Zhu, Wen Hui ^a   Chai, Tai Chong ^c  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b STMICROELECTRONICS   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Bump shear simulation; Copper low k structure; Finite element (FE) modeling; Reliability; Solder

Indexed keywords

BRAZING; LEAD; LEAD ALLOYS; MODEL STRUCTURES; NUMERICAL METHODS; RELIABILITY; SILVER; SOLDERING ALLOYS; TIN; WELDING;

BUMP SHEAR SIMULATION; COPPER/LOW-K STRUCTURE; CRITICAL STRESSES; EXPERIMENTAL AND NUMERICAL METHODS; FAILURE MECHANISMS; FINITE-ELEMENT (FE) MODELING; FINITE-ELEMENT MODELING; INTERFACIAL STRENGTHS; METALLIZATION; NUMBER OF LAYERS; OPTIMIZING; PARAMETRIC STUDIES; PB SOLDERS; RELIABILITY EVALUATIONS; SHEAR FORCES; SOLDER BUMPS; STRUCTURE RELIABILITIES;

SOLDERING;

EID: 54949114745     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2008.2002345     Document Type: Article

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