A reliable wire bonding on 130nm Cu/low-k device

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 707-711

  Gu, X ^a   Antol, J ^a   Yao, Y F ^a   Chua, K H ^a  

^a Agere Systems Singapore Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN OF EXPERIMENTS; DIELECTRIC DEVICES; DIELECTRIC MATERIALS; ION BEAMS; LOW TEMPERATURE PRODUCTION; RECONFIGURABLE HARDWARE; THERMODYNAMIC STABILITY; WIRE;

CU/LOW-K; HIGH TEMPERATURE STORAGE; LOW K DIELECTRICS; OPEN CIRCUITS; PROCESS VARIABLES; WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 33747590590     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271610     Document Type: Conference Paper

References (9)

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