Extensive fatigue investigation of solder joints in igbt high power modules

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1436-1442

  Thebaud, J M ^a   Woirgard, E ^a   Zardini, C ^a   Sommer, K H ^b  

^a UNIVERSITÉ DE BORDEAUX   (France)

^b INFINEON (EUPEC   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE ANALYSIS; FATIGUE TESTING; INSULATED GATE BIPOLAR TRANSISTORS; POWER INTEGRATED CIRCUITS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THYRISTORS;

HIGH POWER MODULES; PRESS PACK PACKAGING; SCANNING ACOUSTIC MICROSCOPY; THERMAL FATIGUE RESISTANCE;

SOLDERED JOINTS;

EID: 0034482686     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)