Comparative study of thermal cycling and thermal shocks tests on electronic components reliability

Microelectronics Reliability

Volumn 44, Issue 9-11 SPEC. ISS., 2004, Pages 1343-1347

  Moreau, S ^a,b   Lequeu, T ^a   Jerisian R ^a  

^a LMP   (France)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DATA ACQUISITION; FAILURE (MECHANICAL); MICROELECTRONICS; POWER ELECTRONICS; RELIABILITY; SHOCK TESTING; STATISTICAL METHODS; THERMAL CYCLING; THERMAL STRESS; THERMOMECHANICAL TREATMENT;

THERMAL SHOCK TESTS; THERMO-MECHANICAL RELIABILITY;

ELECTRONIC EQUIPMENT;

EID: 4544317357     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.07.027     Document Type: Conference Paper

References (5)

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2. Department of Defense - United States of America Test Method Standard - Semiconductor devices - MIL-STD-750D (4th edn) 28 February 1995
3. Abernathy R. B. The New Weibull Handbook (4th edn). 2000, 310 p.
4. ANSYS User Manual (V7.1)
5. Lee W., Nguyen L.T. and Selvaduray G. Solder Joint Fatigue Models - Review and Applicability to Chip Scale Packages. Microelectronics Reliability, 40 (2000), pp 231-244.