Improving the thermal reliability of large area solder joints in IGBT power modules

2006 4th International Conference on Integrated Power Systems, CIPS 2006

Volumn , Issue , 2006, Pages

  Guth, Karsten ^a   Mahnke, Peter ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER SYSTEMS; HEAT RESISTANCE; STRAIN; THERMAL EXPANSION;

COEFFICIENTS OF THERMAL EXPANSIONS; EXTERNAL OPERATING CONDITIONS; MATERIAL PARAMETER; NUMBER OF CYCLES; PROPAGATION OF CRACKS; SUBSTRATE LAYOUT; THERMAL RELIABILITY; THERMO-MECHANICAL;

INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

EID: 84971421791     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. E. Wolfgang, Reliability of high-power semiconductor devices: from state of the art to future trends, Proc. PCIM Europe (1999), p. 1 .
2. W. Wu et al, Investigation on the long term reliability of power IGBT modules, Proc. ISPSD (1995), p. 443.
3. Brite EuRam BE 95-21 05 RAPSDRA: Reliability of Advanced Power Semiconductors for Railway Traction Applications (1998).
4. G. Lefrane, Th. Licht and G. Mitie, Properties of solders and their fatigue in power modules, Microel. Rel., 42 (2002), p. 1 641 .
5. G. Mitic et al, AISiC Composites Materials in IGBT Power Modules, Proc. IEEE lAS (2000).
6. J. Yamada et al, The latest High Perfomance and High Reliability IGBT Technology in New Packages with Conventional Pin Layout, Proc. PCIM Europe (2003).
7. Y. Nishimura et al, All lead free IGBT module with excellent reliability, Proc. ISPSD (2005).
8. Directive 2002/95/EC of the European Parliament and the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment.