Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 3, 2008, Pages 683-690

  Tsai, Ming Yi ^a   Chen, Yu C ^b   Lee, S W Ricky ^c  

^a CHANG GUNG UNIVERSITY   (Taiwan)

^b ASUSTEK COMPUTER INC   (Taiwan)

^c HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Chemical shrinkage; Epoxy molding compound (EMC); Plastic ball grid array (PBGA); Residual strains; Shadow moir ; Warpage

Indexed keywords

ABS RESINS; BOX GIRDER BRIDGES; BRAZING; CREEP; DEFORMATION; ELECTROMAGNETIC COMPATIBILITY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FORMING; GLASS TRANSITION; MECHANICAL PROPERTIES; MOLDING; PLASTIC MOLDS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SHEET MOLDING COMPOUNDS; SHRINKAGE; STRAIN; STRESSES; WELDING;

CHEMICAL SHRINKAGE; EPOXY MOLDING COMPOUND (EMC); PLASTIC BALL GRID ARRAY (PBGA); RESIDUAL STRAINS; WARPAGE;

FINITE ELEMENT METHOD;

EID: 54849377400     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2001168     Document Type: Article

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