Simultaneous measurement of PWB and chip package warpage using the projection moiré technique and automatic image segmentation

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 607-613

  Powell, Reinhard E ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTOUR MODELS; PLASTIC BALL GRID ARRAY (PBGA);

ALGORITHMS; CHIP SCALE PACKAGES; IMAGE SEGMENTATION; MOIRE FRINGES; ONLINE SYSTEMS; PROJECTION SYSTEMS;

PRINTED CIRCUIT BOARDS;

EID: 33845598594     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645712     Document Type: Conference Paper

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