The Impact of Moisture in Mold Compound Preforms on the Warpage of PBGA Packages

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 273-278

  Lin, T Y ^a   Njoman, B ^a   Crouthamel, D ^a   Chua, K H ^a   Teo, S Y ^b  

^a Agere Systems Singapore Pte Ltd   (Singapore)

^b Nitto Denko Electron Malaysia PL   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; INTEGRATED CIRCUIT MANUFACTURE; MOISTURE; MOLDING; CLEAN ROOMS; CURING; INDUSTRIAL ELECTRONICS; INTEGRATED CIRCUIT TESTING; INTEGRATED CIRCUITS; MANUFACTURE; MECHANICAL PROPERTIES; MECHANICAL VARIABLES MEASUREMENT; MOISTURE DETERMINATION; MOLDS; PREFORMING; STRESSES; TESTING; THERMAL STRESS;

POST MOLD CURING (PMC);

ELECTRONICS PACKAGING; MOISTURE CONTROL;

FLEXURAL MODULUS; IC MANUFACTURING; INTEGRATED CIRCUIT PACKAGING; MANUFACTURING PROCESS; MECHANICAL FACTORS; MOISTURE CONDITIONS; MOISTURE EFFECTS; MOISTURE MEASUREMENT;

EID: 0141788712     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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9. B.Njoman, "A study on the effects of moisture exposure on the mold compound", Agere systems internal report, 2002.
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