Development of real time/variable sensitivity warpage measurement technique and its application to plastic ball grid array package

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 1, 1999, Pages 63-70

  Verma, Kaushal ^b   Columbus, Derek ^b   Han, Bongtae ^a,b  

^a IEEE

^b Clemson University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INFRARED DEVICES; THERMAL CYCLING;

FAR INFRARED FIZEAU INTERFEROMETRY (FIFI); SHADOW MOIRE WITH ENHANCED SENSITIVITY (SMES); WARPAGE;

INTERFEROMETERS;

EID: 0033320167     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.755090     Document Type: Article

References (15)

1. B. Han, Y. Guo, and H. C. Choi, "Out-of-plane displacement measurement of printed circuit board by shadow moiré with variable sensitivity," in Proc. 1993 ASME Int. Electron. Packag. Conf., Binghamton, NY, Sept. 1993.
2. Y. Guo, "Applications of shadow Moiré method in determination of thermal deformations in electronic packaging," in Proc. 1995 SEM Spring Conf., Grand Rapids, MI, 1995.
3. B. Han and Y. Guo, "Photomechanics tools as applied to electronic packaging product development," B. Han, R. Mahajan, and D. Barker, Eds., Experimental/Numerical Mechanics in Electronics Packaging. Bethel, CT: SEM, 1997, vol. 1, pp. 1-14.
4. D. Post, B. Han, and P. Ifju, High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials. New York: Springer-Verlag, 1994.
5. P. Beckmann and A. Spizzichino, The Scattering of Electromagnetic Wave from Rough Surface. New York: Macmillan, 1963.
6. 2 laser source," Appl. Opt., vol. 7, no. 9, pp. 1858-1859, 1968.
7. O. Kwon, J. C. Wyant, and C. R. Hayslett, "Rough surface interferometry at 10.6 μm," Appl. Opt., vol. 19, no. 11, pp. 1862-1869, 1980.
8. J. Sinha and H. Tippur, "Infrared interferometry for rough surface measurements: Application to failure characterization and flaw detection," Opt. Eng., vol. 38, no. 8, pp. 2233-2239, 1997.
9. V. T. Chitnis, Y. Uchida, K. Hane, and S. Hattori, "Moiré signals in reflection," Opt. Commun., vol. 54, no. 4, pp. 207-211, 1985.
10. S. Hattori, Y. Uchida, and V. T. Chitnis, "An automatic super-accurate positioning technique using moiré interference," Bull. Jpn. Soc. Precision Eng., vol. 20, no. 2, pp. 73-78, 1986.
11. T. W. Shield and K. S. Kim, "Diffraction theory of optical interference moiré and a device for production of variable virtual reference gratings: A moiré microscope," Exper. Mech., vol. 31, no. 2, pp. 126-134, 1991.
12. B. Han, "Interferometric methods with enhanced sensitivity by optical/digital fringe multiplication," Appl. Opt., vol. 32, no. 25, pp. 4713-4718, 1993.
13. E. E. Marotta and B. Han, "Thermal control of interface for microelectronic packaging," in Proc. 1998 MRS Annu. Spring Meeting, San Francisco, CA, Apr. 1998.
14. S. Ahan, Y. Kwon, and K. Shin, "Popcorn phenomenon in a ball grid array package," in Proc. 44th Electron. Comp. Technol. Conf., Washington, DC, May 1994, pp. 1101-1107.
15. J. H. Lau, J. Miremadi, J. Gleason, R. Haven, S. Ottoboni, and S. Mimura, "No clean mass reflow of large overmolded plastic pad array carriers," in Proc. IEEE Int. Electron. Manufact. Technol. Symp., Oct. 1993, pp. 63-75.