Study of rapid cure BGA mold compound on warpage with shadow moire

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 708-713

  Wu, Jim C L ^a   Shiue, Han hien ^a   Wu, Sting ^a   Hung, Mike ^a   Lee, J J ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CURING; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; OPTIMIZATION; PLASTICS; RELIABILITY; THERMAL EFFECTS; THERMAL EXPANSION; THERMOSETS; VISCOELASTICITY; VISCOSITY;

RAPID CURE MOLD COMPOUND; SHADOW MOIRE; WARPAGE; WARPAGE CONTROL;

SHEET MOLDING COMPOUNDS;

EID: 0032642994     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)