Warpage measurement comparison using shadow moiré and projection moiré methods

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 4, 2002, Pages 714-721

  Ding, Hai ^a   Powell, Reinhard E ^a   Hanna, Carl R ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

HDI; Phase stepping; Projection moire; Shadow moire; Unwrapping; Warpage

Indexed keywords

FABRICATION; INTEGRATED CIRCUITS; INTEGRATED OPTICS; MICROELECTRONICS; RELIABILITY; STRESS ANALYSIS; SUBSTRATES;

WARPAGE MEASUREMENTS;

ELECTRONICS PACKAGING;

EID: 0036999768     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.808010     Document Type: Conference Paper

References (13)

1. D. Herrell, "Power to the package," IEEE Spectrum, vol. 36, no. 7, pp. 46-53, 1999.
2. K. Gilleo, "Photonics challenge to electronic packaging," IEEE Trans. Comp., Packag. Manufact. Technol. A, vol. 24, pp. 309-311, June 2001.
3. B. K. Gilbert and G. Pan, "MCM packaging for present- and next-generation high clock-rate digital- and mixed-signal electronic systems: Areas for development," IEEE Trans. Microwave Theory Tech., vol. 45, pp. 1819-1835, Oct. 1997.
4. C. C. Chamis, "Theory for predicting composite laminate warpage resulting from fabrication," in Proc. SPI Reinforced Plastic Composite Inst. Annu. Conf., Washington, DC, Feb. 1975, pp. 1-9.
5. O. Kafri and I. Glatt, The Physics of Moiré Metrology. New York: Wiley, 1989.
6. H. Takasaki, "Moiré topography," Applied Optics, vol. 9, no. 6, pp. 1467-1472, 1970.
7. M. Idesawa, T. Yatagai, and T. Soma, "Scanning moiré method and automatic measurement of 3-D shapes," Applied Optics, vol. 16, no. 8, pp. 2152-2162, 1977.
8. D. Post, B. Han, and P. Ifju, High Sensitivity Moiré. New York: Springer-Verlag, 1994, ch. 3, pp. 118-130.
9. M. Stiteler and I. C. Ume, "System for real-time measurements of thermally induced warpage in a simulated infrared soldering environment," ASME J. Electron. Packag., vol. 119, pp. 1-7, 1997.
10. H. Ding, R. E. Powell, and I. C. Ume, "A projection moiré system for measuring warpage with case studies," in Proc. Int. Conf. Adv. Packag. Syst., Reno, NV, Mar. 2002.
11. D. C. Ghiglia and M. D. Pritt, Two-Dimensional Phase Unwrapping: Theory, Algorithms, and Software. New York: Wiley, 1998.
12. D. Malacara, M. Servin, and Z. Malacara, Interferogram Analysis for Optical Testing. New York: Marcel Dekker, Inc., 1998, pp. 169-245.
13. G. J. Petriccione and I. C. Ume, "Warpage studies of HDI test vehicles during various thermal profiling," IEEE Trans. Adv. Packag., vol. 22, no. 4, pp. 624-637, 1999.