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Volumn 5392, Issue , 2004, Pages 148-157

Characterization of materials with nanoscopic filler particles by AFM techniques

Author keywords

Composites; Nano particles; NanoDAC deformation measurement; Scanning probe microscopy

Indexed keywords

MICROGRAPHS; NANO PARTICLES; NANODAC DEFORMATION MEASUREMENT; SCANNING PROBE MICROSCOPY (SPM);

EID: 5444245580     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.540073     Document Type: Conference Paper
Times cited : (3)

References (12)
  • 1
    • 0023645384 scopus 로고
    • Residual stress and thermal expansion of spun-on polyimide films
    • Elsner G. Residual stress and thermal expansion of spun-on polyimide films, Journ. of Appl. Polymer Sciences, 1987; 34: 815-828.
    • (1987) Journ. of Appl. Polymer Sciences , vol.34 , pp. 815-828
    • Elsner, G.1
  • 2
    • 0002704702 scopus 로고    scopus 로고
    • Stress-strain diagrams of microfabricated thin films
    • Berlin, April 16-18
    • Ogawa H. Stress-strain diagrams of microfabricated thin films. Proc. of "Micro Materials '97", Berlin, April 16-18, 1997: 716-719.
    • (1997) Proc. of "Micro Materials '97" , pp. 716-719
    • Ogawa, H.1
  • 3
    • 19044380284 scopus 로고    scopus 로고
    • Determination of packaging material properties utilizing image correlation techniques
    • December
    • D. Vogel, R. Kühnert, M. Dost, B. Michel: Determination of Packaging Material Properties Utilizing Image Correlation Techniques, Journal of Electronic Packaging, December 2002, Vol. 124, pp. 345-351.
    • (2002) Journal of Electronic Packaging , vol.124 , pp. 345-351
    • Vogel, D.1    Kühnert, R.2    Dost, M.3    Michel, B.4
  • 6
    • 0037198099 scopus 로고    scopus 로고
    • Micro- And nanomaterials characterization by image correlation methods
    • D. Vogel, A. Gollhardt, B. Michel: Micro- and nanomaterials characterization by image correlation methods, Sensors and Actuators A 99 (2002) 165-171.
    • (2002) Sensors and Actuators A , vol.99 , pp. 165-171
    • Vogel, D.1    Gollhardt, A.2    Michel, B.3
  • 7
    • 0033694037 scopus 로고    scopus 로고
    • Measurement of thermally induced strains on flip chip and chip scale packages
    • Las Vegas, USA, May 23-26
    • D. Vogel, E. Kaulfersch, J. Simon, R. Kühnert, A. Schubert, B. Michel: Measurement of Thermally Induced Strains on Flip Chip and Chip Scale Packages, Proc. of ITherm 2000, Las Vegas, USA, 2000, May 23-26, pp. 232-239.
    • (2000) Proc. of ITherm 2000 , pp. 232-239
    • Vogel, D.1    Kaulfersch, E.2    Simon, J.3    Kühnert, R.4    Schubert, A.5    Michel, B.6
  • 8
    • 54049083120 scopus 로고    scopus 로고
    • Microcrack evaluation for electronics components by AFM nanoDAC deformation measurement
    • Oct. 28-30, Maui, Hawaii
    • D. Vogel, B. Michel: Microcrack Evaluation for Electronics Components by AFM nanoDAC Deformation Measurement, Proc. of IEEE-NANO 2001, Oct. 28-30, 2001, Maui, Hawaii, pp. 309-312.
    • (2001) Proc. of IEEE-NANO 2001 , pp. 309-312
    • Vogel, D.1    Michel, B.2
  • 9
    • 0036504397 scopus 로고    scopus 로고
    • A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy
    • March
    • I. Chasiotis, W. Knauss: A New Microtensile Tester for the Study of MEMS Materials with the Aid of Atomic Force Microscopy, Experimental Mechanics, Vol. 42, No. 1, March 2002, pp. 51-57
    • (2002) Experimental Mechanics , vol.42 , Issue.1 , pp. 51-57
    • Chasiotis, I.1    Knauss, W.2
  • 10
    • 0036681733 scopus 로고    scopus 로고
    • High resolution AFM scanning moiré method and its application to the micro-deformation in the EGA electronic package
    • H. Xie, A. Asundi, C.G. Boay, L. Yungguang, J. Yu, Z. Zhaowei, B. K.A Ngoi: High Resolution AFM Scanning Moiré Method and its Application to the Micro-Deformation in the EGA Electronic Package. Microelectronics Reliability, Vol. 42, 2002, pp. 1219-1227.
    • (2002) Microelectronics Reliability , vol.42 , pp. 1219-1227
    • Xie, H.1    Asundi, A.2    Boay, C.G.3    Yungguang, L.4    Yu, J.5    Zhaowei, Z.6    Ngoi, B.K.A.7
  • 12
    • 0035773676 scopus 로고    scopus 로고
    • Characterization of electronic packaging materials and components by image correlation methods, advanced photonic sensors and applications II
    • Nov. 27-30, Singapore
    • D. Vogel, J. Auersperg, B. Michel: Characterization of Electronic Packaging Materials and Components by Image Correlation Methods, Advanced Photonic Sensors and Applications II, Nov. 27-30, 2001, Singapore, Proc. of SPIE, Vol. 4596, pp. 237-247.
    • (2001) Proc. of SPIE , vol.4596 , pp. 237-247
    • Vogel, D.1    Auersperg, J.2    Michel, B.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.