-
1
-
-
0023645384
-
Residual stress and thermal expansion of spun-on polyimide films
-
Elsner G. Residual stress and thermal expansion of spun-on polyimide films, Journ. of Appl. Polymer Sciences, 1987; 34: 815-828.
-
(1987)
Journ. of Appl. Polymer Sciences
, vol.34
, pp. 815-828
-
-
Elsner, G.1
-
2
-
-
0002704702
-
Stress-strain diagrams of microfabricated thin films
-
Berlin, April 16-18
-
Ogawa H. Stress-strain diagrams of microfabricated thin films. Proc. of "Micro Materials '97", Berlin, April 16-18, 1997: 716-719.
-
(1997)
Proc. of "Micro Materials '97"
, pp. 716-719
-
-
Ogawa, H.1
-
3
-
-
19044380284
-
Determination of packaging material properties utilizing image correlation techniques
-
December
-
D. Vogel, R. Kühnert, M. Dost, B. Michel: Determination of Packaging Material Properties Utilizing Image Correlation Techniques, Journal of Electronic Packaging, December 2002, Vol. 124, pp. 345-351.
-
(2002)
Journal of Electronic Packaging
, vol.124
, pp. 345-351
-
-
Vogel, D.1
Kühnert, R.2
Dost, M.3
Michel, B.4
-
6
-
-
0037198099
-
Micro- And nanomaterials characterization by image correlation methods
-
D. Vogel, A. Gollhardt, B. Michel: Micro- and nanomaterials characterization by image correlation methods, Sensors and Actuators A 99 (2002) 165-171.
-
(2002)
Sensors and Actuators A
, vol.99
, pp. 165-171
-
-
Vogel, D.1
Gollhardt, A.2
Michel, B.3
-
7
-
-
0033694037
-
Measurement of thermally induced strains on flip chip and chip scale packages
-
Las Vegas, USA, May 23-26
-
D. Vogel, E. Kaulfersch, J. Simon, R. Kühnert, A. Schubert, B. Michel: Measurement of Thermally Induced Strains on Flip Chip and Chip Scale Packages, Proc. of ITherm 2000, Las Vegas, USA, 2000, May 23-26, pp. 232-239.
-
(2000)
Proc. of ITherm 2000
, pp. 232-239
-
-
Vogel, D.1
Kaulfersch, E.2
Simon, J.3
Kühnert, R.4
Schubert, A.5
Michel, B.6
-
8
-
-
54049083120
-
Microcrack evaluation for electronics components by AFM nanoDAC deformation measurement
-
Oct. 28-30, Maui, Hawaii
-
D. Vogel, B. Michel: Microcrack Evaluation for Electronics Components by AFM nanoDAC Deformation Measurement, Proc. of IEEE-NANO 2001, Oct. 28-30, 2001, Maui, Hawaii, pp. 309-312.
-
(2001)
Proc. of IEEE-NANO 2001
, pp. 309-312
-
-
Vogel, D.1
Michel, B.2
-
9
-
-
0036504397
-
A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy
-
March
-
I. Chasiotis, W. Knauss: A New Microtensile Tester for the Study of MEMS Materials with the Aid of Atomic Force Microscopy, Experimental Mechanics, Vol. 42, No. 1, March 2002, pp. 51-57
-
(2002)
Experimental Mechanics
, vol.42
, Issue.1
, pp. 51-57
-
-
Chasiotis, I.1
Knauss, W.2
-
10
-
-
0036681733
-
High resolution AFM scanning moiré method and its application to the micro-deformation in the EGA electronic package
-
H. Xie, A. Asundi, C.G. Boay, L. Yungguang, J. Yu, Z. Zhaowei, B. K.A Ngoi: High Resolution AFM Scanning Moiré Method and its Application to the Micro-Deformation in the EGA Electronic Package. Microelectronics Reliability, Vol. 42, 2002, pp. 1219-1227.
-
(2002)
Microelectronics Reliability
, vol.42
, pp. 1219-1227
-
-
Xie, H.1
Asundi, A.2
Boay, C.G.3
Yungguang, L.4
Yu, J.5
Zhaowei, Z.6
Ngoi, B.K.A.7
-
11
-
-
0037412068
-
Focused ion beam Moiré method
-
Huimin Xie, Biao Li, Robert Geer, Bai Xu, James Castracane: Focused ion beam Moiré method, Optics and Lasers in Engineering 40, 2003, pp. 163 -177.
-
(2003)
Optics and Lasers in Engineering
, vol.40
, pp. 163-177
-
-
Xie, H.1
Li, B.2
Geer, R.3
Xu, B.4
Castracane, J.5
-
12
-
-
0035773676
-
Characterization of electronic packaging materials and components by image correlation methods, advanced photonic sensors and applications II
-
Nov. 27-30, Singapore
-
D. Vogel, J. Auersperg, B. Michel: Characterization of Electronic Packaging Materials and Components by Image Correlation Methods, Advanced Photonic Sensors and Applications II, Nov. 27-30, 2001, Singapore, Proc. of SPIE, Vol. 4596, pp. 237-247.
-
(2001)
Proc. of SPIE
, vol.4596
, pp. 237-247
-
-
Vogel, D.1
Auersperg, J.2
Michel, B.3
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