Fabrication and characterization of a three-dimensional flexible thermopile

Japanese Journal of Applied Physics

Volumn 47, Issue 3 PART 1, 2008, Pages 1787-1793

  Lin, Puru ^a   Wu, Ching Yi ^a   Cheng, Yung Ming ^a   Lin, Yuh Jiuan ^b   Huang, Fon Shan ^a   Huang, Star Ruey Shing ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Flexible; Polyimde; Thermopile; Wet etching

Indexed keywords

COPPER; ELECTRIC BATTERIES; ETCHING; FABRICATION; POLYIMIDES; POLYMERS; SENSOR NETWORKS; TERNARY SYSTEMS; THERMAL EFFECTS; THERMOCOUPLES; THERMOMETERS; THERMOPILES; THREE DIMENSIONAL; TWO DIMENSIONAL;

3D LAYOUTS; BOTTOM SURFACES; COLD JUNCTIONS; DIGITAL THERMOMETERS; ETCHING SOLUTIONS; EXPERIMENTAL STUDIES; FABRICATED DEVICES; FLEXIBLE; FLEXIBLE SUBSTRATES; HOT JUNCTIONS; LOW COSTS; OPTIMAL COMPOSITIONS; POLYIMDE;

WET ETCHING;

EID: 54249131298     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.1787     Document Type: Article

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