Thermal-type micro sensor array on PI film substrate having wet-etched through-holes for interconnection

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1614-1617

  Han, Ji Song ^a   Tan, Zhi Yong ^a   Sato, K ^a   Shikida, M ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

Adhesives; Mechanical sensors; Nickel; Packaging; Polyimides; Resistance heating; Sensor arrays; Substrates; Thermal sensors; Wet etching

Indexed keywords

ACTUATORS; ADHESIVES; CHIP SCALE PACKAGES; COPPER; COPPER PLATING; ELECTRONICS PACKAGING; METALLIC FILMS; MICROSENSORS; MICROSYSTEMS; NICKEL; PACKAGING; POLYIMIDES; SENSOR ARRAYS; SUBSTRATES; TRANSDUCERS; WET ETCHING;

ELECTROLESS CU PLATING; MECHANICAL FLEXIBILITY; MECHANICAL SENSORS; RESISTANCE-HEATING; TEMPERATURE COEFFICIENT OF RESISTANCE; THERMAL SENSORS; THREE DIMENSIONAL PACKAGING; ULTRA-THIN STRUCTURES;

SOLID-STATE SENSORS;

EID: 84944742687     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217090     Document Type: Conference Paper

References (5)

1. Kinya Ichikawa, Packaging technology-challenges and future directions, SEMI Technology Symposium (STS) 2002, SEMICON Japan 2002, Dec. 4-6, pp. 9-16.
2. Fukang Jiang, Gwo-Bin Lee, Yu-Chong Tai, and Chin-Ming Ho, A flexible micromachine-based shear-stress sensor array and its application to separation-point detection, Sensors and Actuators A/Physical, 79 (2000) 194-203.
3. Vladimir J. Lumelsky, Fellow, IEEE, Michael S. Shur, Fellow, IEEE, and Sigurd Wagner, Fellow, IEEE, Sensitive Skin, IEEE Sensors Journal, Vol. 1, No. 1, June 2001.
4. http://www.td-net.co.jp/Kapton/index.html
5. Han Ji-song, T. Kadowaki, K. Sato, and M. Shikida, Fabrication of thermal-isolation structure for microheater elements applicable to fingerprint sensors, Sensors and Actuators A/Physical, 100(2002) 114-222.