Development of an electroplating solution for codepositing Au-Sn alloys

Materials Science and Engineering B: Solid-State Materials for Advanced Technology

Volumn 65, Issue 2, 1999, Pages 111-122

  Sun, W ^a   Ivey, D G ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ADDITIVES; COMPOSITION EFFECTS; DEPOSITION; ELECTROCHEMISTRY; ELECTROPLATING SOLUTIONS; GOLD ALLOYS;

BUFFERING AGENTS;

SOLDERING ALLOYS;

EID: 0033570521     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(99)00223-8     Document Type: Article

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