Electrical properties of a-C: Mo films produced by dual-cathode filtered cathodic arc plasma deposition

Diamond and Related Materials

Volumn 17, Issue 12, 2008, Pages 2080-2083

  Sansongsiri, Sakon ^a,b   Anders, André ^a   Yotsombat, Banchob ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b CHIANG MAI UNIVERSITY   (Thailand)

Author keywords

Cathodic arc deposition; Electrical properties; Metal doped amorphous carbon; Raman spectroscopy

Indexed keywords

ACTIVATION ENERGY; AMORPHOUS FILMS; CARBON; CARBON FILMS; CAVITY RESONATORS; CHARGE CARRIERS; CHEMICAL VAPOR DEPOSITION; ELECTRIC ARCS; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; GRAPHITE; MOLYBDENUM; PLASMA DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMAS; SUBSTRATES; THICK FILMS;

A CARBONS; AMBIENT AIRS; BIAS CONDITIONS; CATHODIC ARC DEPOSITION; CHARGE CARRIER DENSITIES; DENSITY OF STATES; ELECTRICAL ACTIVATIONS; ELECTRICAL PROPERTIES; EX-SITU; EXPONENTIAL FACTORS; FILM RESISTIVITIES; FILM SHIFTS; FILTERED CATHODIC ARC PLASMAS; IN-SITU; INTENSITY RATIOS; MO CONTENTS; PROCESS TEMPERATURES; ROOM TEMPERATURES; SUBSTRATE BIAS VOLTAGES; SUBSTRATE BIASSED; THIN-FILMS;

AMORPHOUS CARBON;

EID: 54049095861     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2008.07.006     Document Type: Article

References (23)

1. Q. Wei, R.J. Narayan, A.K. Sharma, J Sankar, J. Nayayan, J. Vac. Sci. Technol., A, Vac. Surf. Films 17 (1999) 3406.
2. Voevodin A.A., Prasad S.V., and Zabinski J.S. J. Appl. Phys. 82 (1997) 855
3. Klaffke D., and Skopp A. Surf. Coat. Technol. 98 (1998) 953
4. Fu R.K.Y., Mei Y.F., Fu M.Y., Liu X.Y., and Chu P.K. Diamond Relat. Mater. 14 (2005) 1489
5. Bewilogua K., Cooper C.V., Specht C., Schroder J., Wittorf R., and Grischke M. Surf. Coat. Technol. 127 (2000) 224
6. Frenkel J. Phys. Rev. 54 (1938) 647
7. Huang Q.F., Yoon S.F., Rusli E., Yang H., Gan B., Chew K., and Ahn J. J. Appl. Phys. 88 (2000) 4191
8. Fu R.K.Y., Mei Y.F., Shen L.R., Siu G.G., Chu P.K., Cheung W.Y., and Wong S.P. Surf. Coat. Technol. 186 (2004) 112
9. Wang D.Y., Weng K.W., and Hwang S.Y. Diamond Relat. Mater. 9 (2000) 1762
10. Byon E., Oates T.H., and Anders A. Appl. Phys. Lett. 82 (2003) 1634
11. Anders A., Pasaja N., and Sansongsiri S. Rev. Sci. Instrum. 78 (2007) 063901
12. Anders S., Raoux S., Krishnan K., MacGill R.D., and Brown I.G. J. Appl. Phys. 79 (1996) 6785
13. Bilek M.M.M., Anders A., and Brown I.G. Plasma Sources Sci. Technol. 10 (2001) 606
14. MacGill R.A., Dickinson M.R., Anders A., Monteiro O.R., and Brown I.G. Rev. Sci. Instrum. 69 (1998) 801
15. Anders A., Brown I.G., MacGill R.A., and Dickinson M.R. J. Phys. D: Appl. Phys. 31 (1998) 584
16. Bilek M.M.M., and Anders A. Plasma Sources Sci. Technol. 8 (1999) 488
17. Anders A., MacGill R.A., and McVeigh T.A. Rev. Sci. Instrum. 70 (1999) 4532
18. Meyer W., and Neldel H. Z. Tech. Phys. (Leipzig) 18 (1937) 588
19. Meiling H., and Schropp R.E.I. Appl. Phys. Lett. 74 (1999) 1012
20. Ferrari A.C., and Robertson J. Phy. Rev. B 61 20 (2000) 14095
21. Tay B.K., Shi X., Tan H.S., Yang H.S., and Sun Z. Surf. Coat. Technol. 105 (1998) 155
22. Cheng Y.H., Tay B.K., Lau S.P., and Shi X. Surf. Coat. Technol. 146 (2001) 398
23. Anders A., and Yushkov G.Y. J. Appl. Phys. 91 (2002) 4824