Mixed-sputter deposition of Ni-Ti-Cu shape memory films

Thin Solid Films

Volumn 274, Issue 1-2, 1996, Pages 101-105

  Krulevitch, P ^a   Ramsey, P B ^a   Makowiecki, D M ^a   Lee, A P ^a   Northrup, M A ^a   Johnson, G C ^b  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Alloys; Sputtering; Stress; Transmission electron microscopy

Indexed keywords

COMPOSITION; COPPER; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; NICKEL; NICKEL ALLOYS; SHAPE MEMORY EFFECT; SPUTTER DEPOSITION; SUBSTRATES; TARGETS; TITANIUM; TRANSMISSION ELECTRON MICROSCOPY;

COMPOSITIONAL FLEXIBILITY; MIXED SPUTTER DEPOSITION; NICKEL TITANIUM COPPER FILMS; SHAPE MEMORY FILMS; TEMPERATURE CONTROLLED SUBSTRATE CURVATURE MEASUREMENTS; TRANSFORMATION TEMPERATURES;

METALLIC FILMS;

EID: 0030101076     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(95)07072-9     Document Type: Article

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