SCOPUS 정보 검색 플랫폼

Materials and Design

Volumn 21, Issue 6, 2000, Pages 583-586

Sputter-deposited Ti-Ni-Cu shaped memory alloy thin films

(4) Ren, M H a Wang, L a Xu, D a Cai, B C a

a SHANGHAI JIAO TONG UNIVERSITY (China)

Author keywords

Phase transformation; Residual stress; Shape memory alloys; Thin films; Ti Ni Cu

Indexed keywords

ELECTRIC CONDUCTIVITY MEASUREMENT; FILM PREPARATION; HYSTERESIS; MAGNETRON SPUTTERING; MARTENSITIC TRANSFORMATIONS; MICROANALYSIS; RESIDUAL STRESSES; SILICON; TEMPERATURE; TENSILE STRESS; THIN FILMS; TITANIUM ALLOYS;

ELECTRON PROBE MICROANALYSIS; SUBSTRATE CURVATURE MEASUREMENT; TEMPERATURE HYSTERESIS; TITANIUM NICKEL COPPER ALLOYS;

SHAPE MEMORY EFFECT;

COPPER-NICKEL ALLOY; FILM; TITANIUM ALLOY;

EID: 0034580667 PISSN: 02641275 EISSN: None Source Type: Journal
DOI: 10.1016/s0261-3069(00)00007-8 Document Type: Conference Paper

Times cited : (23)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.