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Materials Science and Engineering: A

Volumn 438-440, Issue SPEC. ISS., 2006, Pages 683-686

Shape memory behavior of Ti-Ni-Cu thin films

(4) Ishida, A a Sato, M a Ogawa, K a Yamada, K a

a NATIONAL INSTITUTE FOR MATERIALS SCIENCE (Japan)

Author keywords

MEMS; Shape memory; Sputtering; Thin film; Ti Ni Cu

Indexed keywords

ANNEALING; HYSTERESIS; MARTENSITIC TRANSFORMATIONS; PLASTIC DEFORMATION; SHAPE MEMORY EFFECT; SPUTTERING; STRESSES; TEMPERATURE; THERMAL EFFECTS; THIN FILMS;

ANNEALING TEMPERATURE; SHAPE MEMORY BEHAVIOR; TEMPERATURE HYSTERESES; TITANIUM-NICKEL-COPPER THIN FILMS;

TITANIUM ALLOYS;

ANNEALING; HYSTERESIS; MARTENSITIC TRANSFORMATIONS; PLASTIC DEFORMATION; SHAPE MEMORY EFFECT; SPUTTERING; STRESSES; TEMPERATURE; THERMAL EFFECTS; THIN FILMS; TITANIUM ALLOYS;

EID: 33750482587 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2006.02.154 Document Type: Article

Times cited : (42)

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