Analytical thermal placement for VLSI lifetime improvement and minimum performance variation

2007 IEEE International Conference on Computer Design, ICCD 2007

Volumn , Issue , 2007, Pages 71-77

  Kahng, Andrew B ^a   Kang, Sung Mo ^b   Li, Wei ^b   Liu, Bao ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL PLACEMENT; CELL SPREADING; CIRCUIT LIFETIME; COMPUTER DESIGNS; INTERNATIONAL CONFERENCES; LIFETIME IMPROVEMENT; ON-CHIP TEMPERATURE; PERFORMANCE VARIATIONS; TEST CASES; VLSI DESIGNS; VLSI PLACEMENT; WIRE LENGTHS;

OPTIMIZATION;

VLSI CIRCUITS;

EID: 52949118082     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCD.2007.4601882     Document Type: Conference Paper

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