Toward determining optimal mechanical properties in adhesives for flip chip and wirebonded low K die

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 10-12

  Carson, George ^a   Todd, Michael ^a  

^a HENKEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION (CTE); HIGH DENSITY INTERCONNECTIONS; INTERLAYER DIELECTRIC (ILD); ORGANIC PASSIVATIONS;

ADHESIVES; COST EFFECTIVENESS; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; GLASS TRANSITION; MECHANICAL PROPERTIES; SILICON NITRIDE; SOLDERED JOINTS; THERMAL CYCLING;

FLIP CHIP DEVICES;

EID: 4644360386     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Rajagopalan, S., "Low-K Underfills", Proceedings of IMAPS Packaging Copper/Low-K Semiconductors Workshop - December 15 - 17, 2003.
2. Todd, M., "Development of Low Stress Materials for Low-k Copper Integrated Circuit Packaging, Proceedings of IMAPS Packaging Copper/Low-K Semiconductors Workshop - December 15 - 17, 2003.