Research on the contact resistance and reliability of flexible RFID tag inlays packaged by anisotropic conductive paste

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Cai, Xiong Hui ^a   An, Bing ^a   Wu, Yi Ping ^a   Wu, Feng Shun ^a   Lai, Xiao Wei ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Anisotropic conductive adhesive; Radio frequency identification; Reliability

Indexed keywords

ABSORPTION; ADHESIVE JOINTS; ANTENNA ACCESSORIES; CHEMICAL OXYGEN DEMAND; CHIP SCALE PACKAGES; CONTACT RESISTANCE; CURING; DEGRADATION; DIFFUSION BONDING; DRYING; ELECTRONICS PACKAGING; EPOXY RESINS; HEAT RESISTANCE; METAL CLADDING; MIXING; MOBILE PHONES; MOISTURE; OXIDATION; PAINTING; PHOTOMASKS; RADIO NAVIGATION; RESINS; SHEAR STRENGTH; SILVER; SULFATE MINERALS; TECHNOLOGY; TESTING; THERMAL EXPANSION; THERMAL SPRAYING;

AG PARTICLES; ANISOTROPIC CONDUCTIVE ADHESIVE; ANISOTROPIC CONDUCTIVE PASTE; ANTI-OXIDATION; BEFORE AND AFTER; BONDING PROCESSES; BONDING STRENGTHS; COEFFICIENT OF THERMAL EXPANSION; CONDUCTIVE PARTICLES; CURING AGENTS; DEGRADATION MECHANISMS; ELECTRONIC PACKAGING; FLIP CHIPPING; HIGH-DENSITY PACKAGING; INTERNATIONAL CONFERENCES; MOISTURE ABSORPTIONS; POST CURING; RADIO FREQUENCY IDENTIFICATION; RAPID MANUFACTURING; RELIABILITY; RELIABILITY TESTING; RF-ID TAGS; SHEAR BONDING STRENGTH; STRAIN RELEASE; ULTRA-HIGH FREQUENCIES;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 52449120371     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4606959     Document Type: Conference Paper

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