High frequency flip chip interconnection on liquid crystal polymer substrate using anisotropic conductive adhesive

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Volumn , Issue , 2004, Pages 137-140

  Zou, Gang ^a   Grönqvist, Hans ^b   Lai, Zonghe ^a   Södervall, Ulf ^a   Liu, Johan ^a,b,c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b IVF Argongatan 30 ^*  (Sweden)

^c SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; CONDUCTIVE MATERIALS; ELECTRIC POWER SYSTEM INTERCONNECTION; FINITE ELEMENT METHOD; LIQUID CRYSTAL POLYMERS; MATHEMATICAL MODELS; SOLDERING; SUBSTRATES;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); FLIP CHIP ASSEMBLY; FLIP CHIP INTERCONNECTION; THERMAL MECHANICAL CHARACTERIZATION;

FLIP CHIP DEVICES;

EID: 17044395510     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. K. Boustedt, "GHz Flip Chip - An Overview", Proc. Electronic Components and Technology Conference, 1998, pp 297-302, Seattle, WA, 1998.
2. R. Sturdivant, "Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip-chips", Proc. IEEE MTT-S International Microwave Symposium, 1995, TRW, Redondo Beach, CA USA. pp.1591-1594.
3. O. Vendier et. al. "Flip-Chip Mounted, Ku-Band Power Amplifier Compliant with Space Applications", IEEE MTT-S, Seattle, 2002, pp. 1389-1392
4. Z. Lai, J. Liu, 'Anisotropically Conductive Adhesive Flip-Chip Bonding on Rigid and Flexible Printed Circuit substrates', IEEE Trans. on Comp., Hybrids, Manufact, Technol., Part A, Vol. 19, No. 3, pp.664-660, Aug. 1996.
5. John W. Bälde, 'Packaging at the Turing Point Technology and Management Issues', A Presentation for IMAPS France 2001, Advancing Microelectronics, May/June 2001, pp. 22-24
6. G. Zou, H. Grönqvist, J. P. Starski and J. Liu, 'Characterizaiton of Liquid Crystal Polymer for High Frequency System- in-a-Package Applications', IEEE Trans. on Advanced Packaging, Nov. 2002, pp. 503-508
7. G. Zou, H. Gr̈nqvist, and J. Liu, "Theoretical Analysis of RF performance of Anisotropic Conductive Adhesive Flip-Chip Joints', accepted to be published by IEEE Trans. on Component and Packaging Technology, 2004
8. http://www.ansys.com/