Patterned array of nanoparticles on substrates via contact printing method with CNTs/AAO stamp

Journal of Nanoscience and Nanotechnology

Volumn 8, Issue 9, 2008, Pages 4803-4807

  Kim, Youn Su ^a   Ahn, Hyo Jin ^a   Nam, Sang Hoon ^a   Lee, Sang Ho ^a   Shim, Hee Sang ^a   Kim, Won Bae ^a  

^a Gwangju Institute of Science and Technology (GIST)   (South Korea)

Author keywords

AAO; CNTs stamp; Contact printing; Hexagonal pattern; Nanoparticle array

Indexed keywords

AAO; CNTS STAMP; CONTACT PRINTING; HEXAGONAL PATTERN; NANOPARTICLE ARRAY;

ALUMINA; CARBON NANOTUBES; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; PLATINUM; PRINTING; SILICON;

SUBSTRATES;

EID: 51749103714     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2008.IC79     Document Type: Conference Paper

References (27)

1. T. W. Odom, J. L. Huang, P. Kim, and C. M. Lieber, Nature 391, 62 (1988).
2. R. Colombelli, K. Srinivasan, M. Troccoli, O. Painter, C. F. Gmachl, D. M. Tennant, A. M. Sergent, D. L. Sivco, A. Y. Cho, and F. Capasso, Science 302, 1374 (2003).
3. U. Heiz, F. Vanolli, A. Sanchez, and W.-D. Schneider, J. Am. Chem. Soc. 120, 9668 (1998).
4. T. Shinjo, T. Okuno, R. Hassdorf, K. Shigeto, and T. Ono, Science 289, 930 (2000).
5. L. M. Demers, D. S. Ginger, S.-J. Park, Z. Li, S.-W. Chung, and C. A. Mirkin, Science 296, 836 (2002).
6. E. L. Sergey, Nano- and Micro-Electromechanical Systems Fundamentals of Nano- and Microengineering, CRC press, New York (2000).
7. L. J. Guo, Adv. Mater. 19, 495 (2007).
8. C. W. Kuo, J. Y. Shiu, and P. Chen, Chem. Mater. 15, 2917 (2003).
9. H. Schmid, H. Wolf, R. Allenspach, H. Riel, S. Karg, B. Michel, and E. Delamarche, Adv. Funct. Mater. 13, 145 (2003).
10. H. Li, D. J. Kang, M. G. Blamire, and W. T. S. Huck, Nano Lett. 2, 347 (2002).
11. Z. Zheng, O. Azzaroni, M. E. Vickers, and W. T. S. Huck, Adv. Funct. Mater. 16, 805 (2006).
12. A. Bernard, E. Delamarche, H. Schmid, B. Michel, H. R. Bosshared, and H. Biebuyck, Langmuir 12, 2225 (1998).
13. L. Ding, W. Zhou, H. Chu, Z. Jin, Y. Zhang, and Y. Li, Chem. Mater. 18, 4109 (2006).
14. N. L. Jeon, I. S. Choi, G. M. Whitesides, N. Y. Kim, P. E. Laibinis, Y. Harada, K. R. Finnie, G. S. Girolami, and R. G. Nuzzo, Appl. Phys. Lett. 76, 4201 (1999).
15. T. Breen, L. P. Fryer, M. R. W. Nunes, and M. E. Rothwell, Langmuir 18, 194 (2002).
16. P. Argyrakis, L. Teo, T. Stevenson, and R. Cheung, Microelectron. Eng. 78, 647 (2005).
17. Q. Guo, X. Teng, and H. Yang, Nano Lett. 4, 1657 (2004).
18. C. Kim, M. Shtein, and S. R. Forrest, Appl. Phys. Lett. 80, 4051 (2002).
19. Y. L. Loo, R. L. Willett, K. W. Baldwin, and J. R. Rogers, Appl. Phys. Lett. 81, 562 (2002).
20. S. J. Tans, A. R. M. Vershueren, and C. Dekker, Nature 393, 49 (2003).
21. J. Li, Q. Ye, A. Cassell, H. T. Ng, R. Stevens, J. Han, and M. Meyyappan, Appl. Phys. Lett. 82, 2491 (2003).
22. J. Luo, Y. J. Xing, J. Zhu, D. P. Yu, Y. G. Zhao, L. Zhang, H. Fang, Z. P. Huang, and J. Xu, Adv. Funct. Mater. 16, 1081 (2006).
23. S. H. Jeong and K. H. Lee, Jpn. J. Appl. Phys. 43, L1106 (2004).
24. H. J. Ahn, J. I. Sohn, Y. S. Kim, H. S. Shim, W. B. Kim, and T. Y. Seong, Electro. Commun. 8, 513 (2006).
25. J. I. Sohn, Y. S. Kim, C. N. Nam, B. K. Cho, T. Y. Seong, and S. H. Lee, Appl. Phys. Lett. 87, 123115 (2005).
26. H. Masuda and K. Fukuda, Science 268, 1466 (1995).
27. D. Walgraef, Eur. Phys. J. Special Topics 146, 443 (2007).