Electromigration study in flip chip solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1450-1455

  Nah, Jae Woong ^a,b   Chen, Kai ^a   Suh, J O ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASYMMETRICAL DISSOLUTION; FLIP CHIP SOLDER JOINTS; SOLDER INTERFACES; UNDER BUMP METALLIZATION (UBM);

ELECTROMIGRATION; FAILURE MODES; FLIP CHIP DEVICES; INTERFACES (MATERIALS); OPTICAL INTERCONNECTS; THICKNESS MEASUREMENT;

SOLDERED JOINTS;

EID: 35348922225     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373986     Document Type: Conference Paper

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