Optimizing Au and in micro-bumping for 3D chip stacking

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1984-1989

  Zhang, W ^a   Matin, A ^a   Beyne, E ^a   Ruythooren, W ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ARSENIC COMPOUNDS; BRAZING; COMPUTER NETWORKS; ELECTRIC CONNECTORS; FLIP CHIP DEVICES; GOLD; MELTING POINT; REACTION KINETICS; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTOR DOPING; SHEAR STRENGTH; THERMOCHEMISTRY; TITANIUM; WELDING;

ELECTRONIC COMPONENTS; LOW TEMPERATURE; TLP BONDING;

INTERMETALLICS;

EID: 51349099023     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550255     Document Type: Conference Paper

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